TY - JOUR
T1 - Influence of Al Content and Bias Voltage on the Microstructure of Ti1-xALxN Hard Coatings
AU - Aliaj, Fisnik AU - Syla, Naim
JO - Journal of Engineering and Applied Sciences
VL - 5
IS - 6
SP - 394
EP - 402
PY - 2010
DA - 2001/08/19
SN - 1816-949x
DO - jeasci.2010.394.402
UR - https://makhillpublications.co/view-article.php?doi=jeasci.2010.394.402
KW - Bias voltage
KW -cathodic arc evaporation
KW -hard coatings
KW -GAXRD
KW -residual stress
KW -Ti-Al-N
AB - Titanium Aluminum Nitride (Ti-Al-N) system is a well established hard coating known for their good physical, chemical and mechanical properties that is used in a variety of fields. The aim of this research is to investigate the influence of bias voltage and aluminum content on the microstructure, chemical composition and the residual stress of Ti-Al-N in order to illuminate the possibility of tailoring the coating properties mentioned above. Four groups of Ti1-xAlxN coatings were deposited by Cathodic Arc Evaporation (CAE) using powder metallurgical targets of Ti1-xTAlxT with xT = 0.50, 0.55, 0.60 and 0.66. The coatings were deposited onto cemented carbide (WC-Co) substrates at a temperature of 500°C, at different bias voltages: -25, -50 and -100 V. Structural characterization of the coatings was performed with Glancing Angle X-Ray Diffraction (GAXRD) and Glow Discharge Optical Emission Spectroscopy (GDOES). The microstructure of the coatings changed from predominantly single-phase fcc for x between ~0.50 and ~0.60 to dual phase fcc+hcp for x = ~0.66. The residual stress and the stress-free lattice parameter were analyzed using GAXRD and the sin2Ψ method was used to evaluate the data. Youngs modulus of 500 GPa and Poissons ratio of 0.3 were utilized in the evaluation. Residual compressive stress increased for about 4 GPa with increasing bias from -25 to -50 V. Further increasing bias from -50 to -100 V resulted only in an increase of about 1GPa. This investigation shows clearly the relations between the target and coating composition where bias is an important parameter.
ER -