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Journal of Engineering and Applied Sciences

ISSN: Online 1818-7803
ISSN: Print 1816-949x
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Carbon Thin Film Deposition by Electroplating

Sharif M Mominuzzaman and Muhammad Athar Uddin
Page: 19-23 | Received 21 Sep 2022, Published online: 21 Sep 2022

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Abstract

Carbon thin films were deposited on Aluminum (Al) and Copper (Cu) substrates by electrolysis of methanol. The effect of camphor (C10 H16O) a natural source, incorporation with methanol is investigated. Camphor with varying amount (1, 2, 3, 4, 5, 7 and 15%) was mixed in methanol solvent to prepare the electrolytes. Aluminum and copper substrates were mounted on the negative electrode. Remarkable change in the variation of current density as a function of applied potential was observed with camphor content. Thin films were deposited on Al and Cu substrates for different percentage of camphor and are compared. Current density is observed to vary with substrate. For both Al and Cu substrates current density was highest for the 2% camphor in methanol solution. The maximum current density with camphor content was different for Al and Cu substrates.


How to cite this article:

Sharif M Mominuzzaman and Muhammad Athar Uddin . Carbon Thin Film Deposition by Electroplating.
DOI: https://doi.org/10.36478/jeasci.2006.19.23
URL: https://www.makhillpublications.co/view-article/1816-949x/jeasci.2006.19.23